Wafer-Scale Packaging and Integration Are Credited for New Generation of Low-Cost MEMS Motion Sensor Products
This paper will describe a new approach coming to the market that will break the barrier to creating the ideal in motion sensors with the promise to meet market needs in size, performance, and cost.
This unique new approach comes from the patented MEMS fabrication process with vertical integration of MEMS with CMOS electronics that achieves wafer-scale packaging to enable a generation of motion sensing products that meet market demand.
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