Latest Whitepapers
System Level Verification and Debug of DDR3/4 Memory Designs
This application note provides an introduction to the DDR memory technology and explains common challenges,...
KOAXXA SMA RF Interconnects Innovation & Technology
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect...
High-Speed SERDES Interfaces In High Value FPGAs
Lattice Semiconductor has introduced two low cost FPGA families with SERDES, the LatticeECP2M, introduced...
BMI160 Small, low-power Inertial Measurement Unit
The BMI160 is a small, low-power, low-noise 16 bit Inertial Measurement Unit designed for use in mobile...
High Static Pressure Fan “San Ace 60” 9HV Type
Sanyo Denki has developed and commercialized the high static pressure fan “San Ace 60” 9HV type (hereinafter...
Improving Appliance Connector Designs
TE Connectivity's new POWER TRIPLE LOCK (PTL) connector solution directly responds to the appliance industry's...
Advantages of Stamped and Formed Technologies in Power Connectors
Tyco Electronics has developed and produced power connectors using alternative manufacturing technologies...
RF MEMS Switch: What You Need to Know
In this application note, the basic operation principle and driving method for OMRON's MEMS switch (2SMES-01),...
Selecting Safety Standards for Machine Safeguarding Requirements
“Safety standards” are requirements designed to ensure the safety of people around products, activities,...
Comparison of jitter measurements in the time and frequency domain
When analyzing the robustness of data transmission systems, jitter is a key indicator. It is recommended...
Ball vs. Sleeve: A Comparison In Bearing Performance
As consumers demand smaller, faster computer systems, OEM design engineers race to create systems with...
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