Processors
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Enabling Multi-Host System Designs with PCI Express Technology
Although not part of the PCI Express spec, nontransparent bridging is completely consistent with it and...
OPTIMIZATION AND OVERHEAD
The intention of this paper is to analyze the overhead of memory used, while employing a C compiler as...
Wall-Mount Rack Solutions for PCI Compliance
Credit, debit and ATM card fraud costs consumers, merchants and financial institutions billions in losses...
ECC vs. Non-ECC MEMORY
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
Powering your FPGA Applications
Field-programmable gate arrays (FPGAs) have gained much attention and widespread application in the end...
The PI33XX: Zero-Voltage Switching Applied to Buck Regulation
The Picor PI33XX Cool-Power® ZVS Buck Regulator Series delivers maximum power density and high effi...
Top 5 Applications for Inductive Sensors on Packaging Machines
Amid the multitude of advanced technologies being integrated into automated packaging operations today,...
MEMS Timing-Keeper Extends Standby Life of Mobile Devices
With increasingly sophisticated Smartphones and mobile devices offering more features and un-tethered...
CMOS to MIPI D-PHY Interface Bridge Soft IP
MIPI D-PHY is a practical PHY for typical camera and display applications. It is designed to replace...
Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...
Low-Voltage Energy Harvesting
Over the past few years, the technology of energy harvesting has emerged from the laboratory to the marketplace....
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